LM3291 www.ti.com snvsa12 ? september 2013 LM3291 product brief 1 features description the LM3291 is a high-speed linear amplifier that, with 23 ? highly programmable high-current linear its companion ic lm3290, constitutes an rf amplifier envelope modulator (em) for supplying 3g/4g power ? > 75 mhz typical small signal bandwidth amplifiers (pa) in envelope tracking systems. the ? extremely low output impedance amplifier provides extremely low output impedance and low output noise over a wide bandwidth. ? high linearity in conjunction with an envelope tracking (et) ? differential analog input compatible with capable rfic and pa, the LM3291 and lm3290 etrak 1.0 standard greatly improve pa efficiency for 3g and lte ? low output noise operation. ? when paired with the lm3290 provides a in et mode, the LM3291 and lm3290 provide complete envelope modulator solution for envelope tracking supply voltage for the pa 3g/4g envelope tracking power amplifiers. maximizing total em + pa efficiency. the envelope ? automatically controlled through lm3290 in an modulator follows the differential envelope reference envelope modulation solution using mipi ? input signal delivered by the rfic to the LM3291. rffe 1.1-compatible interface. the output is a single-ended dynamic power supply voltage to the pa. applications the LM3291 supports 3g and lte operation up to 20 ? 3g/lte handsets mhz signal bandwidth. ? 3g//lte tablets the LM3291?s programmable parameters are controlled by lm3290 via a direct serial interface ? 3g/lte data cards and wireless modems between the two devices. no additional controls are needed in the system. this interface provides flexible control and adjustment options to optimize LM3291 efficiency and noise performance for various frequency bands and power levels. at high tx output power, the em can be operated in et mode where lm3290 and LM3291 together modulate the supply of the pa with the envelope signal to improve overall system efficiency. at low tx output power, the em can be transitioned to average power tracking (apt) mode where LM3291 is placed into shutdown mode to improve system efficiency. the LM3291 is available in a 12-pin lead-free dsbga package. for the full datasheet, samples, or the evm hardware and software please contact a ti representative at et@list.ti.com. 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 mipi is a registered trademark of mobile industry processor interface alliance. 3 all other trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2013, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 2.5v - 5v l c 3g/4g 3g/4g mbmm pa sb pa mipi etrak lm3290 rfic o r bbic 3g/4g battery mipi rffe LM3291 not recommended for new designs
package option addendum www.ti.com 4-sep-2015 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples LM3291tme/nopb nrnd dsbga yfq 12 250 green (rohs & no sb/br) snagcu level-1-260c-unlim -30 to 85 ae LM3291tmx/nopb nrnd dsbga yfq 12 3000 green (rohs & no sb/br) snagcu level-1-260c-unlim -30 to 85 ae (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 4-sep-2015 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
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